EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition which can attain flame retardancy without using a halogen-containing compound, and can obtain a laminated board having sufficient soldering heat resistance and adhesion, and to provide a prepreg and a laminated board using the same.SOLUTION: The e...

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1. Verfasser: TOBISAWA AKIHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin composition which can attain flame retardancy without using a halogen-containing compound, and can obtain a laminated board having sufficient soldering heat resistance and adhesion, and to provide a prepreg and a laminated board using the same.SOLUTION: The epoxy resin composition includes: (A) an epoxy resin shown by general formula (1); (B) a curing agent containing nitrogen in the molecule; and (C) a compound containing phosphorus in the molecule. In the formula, Rs are each independently hydrogen or a 1-10C hydrocarbon group, Rs are each independently hydrogen or a hydrophobic group consisting a 1-10C hydrocarbon, and in a repeating unit, at least one of Ror Rof a benzene ring having Rand Ris a hydrophobic group consisting of a 1-10C hydrocarbon, and n is an integer of 1-10.