INSPECTION METHOD OF ETCHING APPARATUS
PROBLEM TO BE SOLVED: To provide an inspection method of an etching apparatus which can minimize reduction in yield by discriminating an etching apparatus that is causing uneven etching due to the cooling groove of a substrate stage and preventing occurrence of uneven etching in a substrate to be pr...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an inspection method of an etching apparatus which can minimize reduction in yield by discriminating an etching apparatus that is causing uneven etching due to the cooling groove of a substrate stage and preventing occurrence of uneven etching in a substrate to be processed.SOLUTION: In a state where a surface 20a to be processed is irradiated with irradiation light 22 from an illumination lamp 32 while conveying an etched substrate 20 to be processed, a line sensor 33 captures image data of the surface 20a to be processed, and an etching pattern formed on the surface 20a to be processed is specified based on the image data. A decision is made whether an etching device is defective or not by comparing the data of etching pattern with the data of an etching pattern to be formed on the surface 20a to be processed and determining occurrence of uneven etching caused by the cooling groove of a substrate stage. |
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