FILM-SHAPED CONDUCTIVE ADHESIVE, CONNECTION STRUCTURE USING THE SAME AND CIRCUIT BOARD CONNECTION METHOD
PROBLEM TO BE SOLVED: To provide: a film-shaped conductive adhesive which facilitates the management of a heating temperature in a circuit board connection work using the film-shaped conductive adhesive; a connection structure using the adhesive hereof; a heating temperature management method of the...
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| creator | TOSHIOKA HIDEAKI NAKATSUGI KYOICHIRO |
| description | PROBLEM TO BE SOLVED: To provide: a film-shaped conductive adhesive which facilitates the management of a heating temperature in a circuit board connection work using the film-shaped conductive adhesive; a connection structure using the adhesive hereof; a heating temperature management method of the adhesive; and a circuit board connection method based on the management method.SOLUTION: A film-shaped conductive adhesive includes: a thermosetting resin for binder; a latent hardening agent; conductive particles; and an organic solvent having a boiling point in a range of below a mounting temperature (T) of the circuit board to a value of 70% (0.7×T) thereof. A connection structure is connected by the conductive adhesive subjected to heat-hardening. The heat-hardened conductive adhesive contains voids at over 8% to 30%. A circuit board connection method includes: putting the film-shaped conductive adhesive between two circuit boards; and heat-pressing one of the circuit boards by use of a press thermal head, whereby the film-shaped adhesive is heat-hardened and the circuit boards are connected with each other. The method further includes setting a temperature of the press thermal head based on a percentage of the voids in the heat-hardened film-shaped adhesive. |
| format | Patent |
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A connection structure is connected by the conductive adhesive subjected to heat-hardening. The heat-hardened conductive adhesive contains voids at over 8% to 30%. A circuit board connection method includes: putting the film-shaped conductive adhesive between two circuit boards; and heat-pressing one of the circuit boards by use of a press thermal head, whereby the film-shaped adhesive is heat-hardened and the circuit boards are connected with each other. The method further includes setting a temperature of the press thermal head based on a percentage of the voids in the heat-hardened film-shaped adhesive.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; CURRENT COLLECTORS ; DYES ; ELECTRICITY ; INSULATORS ; LINE CONNECTORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111124&DB=EPODOC&CC=JP&NR=2011238433A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111124&DB=EPODOC&CC=JP&NR=2011238433A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOSHIOKA HIDEAKI</creatorcontrib><creatorcontrib>NAKATSUGI KYOICHIRO</creatorcontrib><title>FILM-SHAPED CONDUCTIVE ADHESIVE, CONNECTION STRUCTURE USING THE SAME AND CIRCUIT BOARD CONNECTION METHOD</title><description>PROBLEM TO BE SOLVED: To provide: a film-shaped conductive adhesive which facilitates the management of a heating temperature in a circuit board connection work using the film-shaped conductive adhesive; a connection structure using the adhesive hereof; a heating temperature management method of the adhesive; and a circuit board connection method based on the management method.SOLUTION: A film-shaped conductive adhesive includes: a thermosetting resin for binder; a latent hardening agent; conductive particles; and an organic solvent having a boiling point in a range of below a mounting temperature (T) of the circuit board to a value of 70% (0.7×T) thereof. A connection structure is connected by the conductive adhesive subjected to heat-hardening. The heat-hardened conductive adhesive contains voids at over 8% to 30%. A circuit board connection method includes: putting the film-shaped conductive adhesive between two circuit boards; and heat-pressing one of the circuit boards by use of a press thermal head, whereby the film-shaped adhesive is heat-hardened and the circuit boards are connected with each other. 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A connection structure is connected by the conductive adhesive subjected to heat-hardening. The heat-hardened conductive adhesive contains voids at over 8% to 30%. A circuit board connection method includes: putting the film-shaped conductive adhesive between two circuit boards; and heat-pressing one of the circuit boards by use of a press thermal head, whereby the film-shaped adhesive is heat-hardened and the circuit boards are connected with each other. The method further includes setting a temperature of the press thermal head based on a percentage of the voids in the heat-hardened film-shaped adhesive.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | FILM-SHAPED CONDUCTIVE ADHESIVE, CONNECTION STRUCTURE USING THE SAME AND CIRCUIT BOARD CONNECTION METHOD |
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