FILM-SHAPED CONDUCTIVE ADHESIVE, CONNECTION STRUCTURE USING THE SAME AND CIRCUIT BOARD CONNECTION METHOD

PROBLEM TO BE SOLVED: To provide: a film-shaped conductive adhesive which facilitates the management of a heating temperature in a circuit board connection work using the film-shaped conductive adhesive; a connection structure using the adhesive hereof; a heating temperature management method of the adhesive; and a circuit board connection method based on the management method.SOLUTION: A film-shaped conductive adhesive includes: a thermosetting resin for binder; a latent hardening agent; conductive particles; and an organic solvent having a boiling point in a range of below a mounting temperature (T) of the circuit board to a value of 70% (0.7×T) thereof. A connection structure is connected by the conductive adhesive subjected to heat-hardening. The heat-hardened conductive adhesive contains voids at over 8% to 30%. A circuit board connection method includes: putting the film-shaped conductive adhesive between two circuit boards; and heat-pressing one of the circuit boards by use of a press thermal head, whereby the film-shaped adhesive is heat-hardened and the circuit boards are connected with each other. The method further includes setting a temperature of the press thermal head based on a percentage of the voids in the heat-hardened film-shaped adhesive.