METHOD FOR MANUFACTURING MICROELECTRONIC DEVICE, AND MICROELECTRONIC DEVICE MANUFACTURED BY THE METHOD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a microelectronic device which has a top surface wide enough to make excellent electric connection between a first electric element and a second electric element distributed to a first layer and a second layer stacked one over the other on a substrate, and also has an interconnection having a cross section small enough not to cause damage due to thermal expansion.SOLUTION: The method comprises: a step (102) of manufacturing at least one arm and at least one second arm which have mutually different lengths so that each of the arms connects a conductive pad having a top surface much larger than the cross-sectional area of the arm and a fixing area defined on the substrate mechanically and directly; and a step (106) of forming the conductive pad in a region of the first layer, and displacing the conductive pad to a connection position where the top surface of the conductive pad is present in a plane, parallel with the substrate, at a lower end of or inside a region of the second layer prior to electric connection with the second electric element.