COMPONENT BUILT-IN MODULE, CAMERA MODULE, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To improve performance of active electronic components or other integrated electronic components by gently suppressing heat conduction, where the heat is generated at an integrated electronic component and conducting to active electronic components or other integrated electronic components, which suppresses excessive increase and ununiformity of operating temperature of active electronic components or other integrated electronic components.SOLUTION: A heat generating integrated electronic component 10A is disposed on a wiring layer 4A separated from but laid on the same layer as a wiring layer 4. The generated heat from the integrated electronic component 10A is conducted to a wiring pattern or the like on an underneath wiring layer 5 from the wiring layer 4A through an interlayer connection part 6, then conducted from the wiring pattern of the wiring layer 5 to a side of an active electronic component 12 and conducted from the wiring layer 5 to external of a multilayer substrate 11 through the multilayer substrate 11, then the heat is rid to external.