OPTICAL MODULATOR MODULE

PROBLEM TO BE SOLVED: To provide an optical modulator module including a high-frequency connection wiring substrate, and free from breakage of a modulation substrate, even when an environmental temperature drastically changes.SOLUTION: The optical modulator module includes: the high-frequency connec...

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Bibliographische Detailangaben
Hauptverfasser: IGARASHI NOBUHIRO, NANAMI MASAYA, SATO YUJI, KONO KENJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an optical modulator module including a high-frequency connection wiring substrate, and free from breakage of a modulation substrate, even when an environmental temperature drastically changes.SOLUTION: The optical modulator module includes: the high-frequency connection wiring substrate having a center conductor and a grounding conductor on the body thereof, and configured to input a high-frequency electric signal of 10 Gbps or more from one end side of the center conductor, and output the high-frequency electric signal from the other end side of the center conductor; an optical modulator chip having the modulation substrate with an electro-optical effect, on which a light waveguide and an electrode composed of the center conductor and the grounding conductor is formed, and which is electrically connected to the high-frequency connection wiring substrate so that the high-frequency electric signal output from the high-frequency connection wiring substrate is input thereto; and a housing in which the high-frequency connection wiring substrate and the optical modulator chip are stored. The high-frequency connection wiring substrate and the optical modulator chip are arranged so that the ends of both may be disposed facing each other at a predetermined distance in the electrically connected portions, and the predetermined distance is in the range of 6 to 700 μm.