COMPOSITION FOR PROVISIONAL FIXATION, PROVISIONAL FIXATION MATERIAL, TREATMENT METHOD OF SUBSTRATE AND SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To provide a composition for provisional fixation, capable of forming provisional fixation materials having retention retaining substrates in a process where the high temperature load is applied, and having easily peelable property in a process where the substrates are peeled f...

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Hauptverfasser:	MIYAMATSU TAKASHI, MORI TAKASHI, TAKAMATSU NOBUHIRO, TAKAHASHI SEIICHIRO, HIRO AKIHITO, KAWAGUCHI KAZUO, TAKAMURA HAZUKI, GOTO HIROFUMI, OKUDA RYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a composition for provisional fixation, capable of forming provisional fixation materials having retention retaining substrates in a process where the high temperature load is applied, and having easily peelable property in a process where the substrates are peeled from supports.SOLUTION: There is provided a composition for provisional fixation, comprising (A) a polyethersulfone, (B) a viscosity-imparting agent such as a phenoxy resin, a polymer having a phenolic hydroxy group, a polymer having a pyrrolidone group and a polyalkylene glycol, and (C) a solvent.