CURABLE COMPOSITION AND USAGE OF THE SAME, AND CURING AGENT

PROBLEM TO BE SOLVED: To provide a curable composition from which a cured film can be formed, the film having favorable adhesiveness to a copper substrate, a polyimide film or the like and also having excellent adhesiveness to a plating layer.SOLUTION: The curable composition contains a compound (A)...

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Bibliographische Detailangaben
Hauptverfasser:	MOROKOSHI SHINTA, SATO HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable composition from which a cured film can be formed, the film having favorable adhesiveness to a copper substrate, a polyimide film or the like and also having excellent adhesiveness to a plating layer.SOLUTION: The curable composition contains a compound (A) expressed by general formula (1) and an epoxy resin (B). In formula (1), Rand Reach independently represent an organic group having 1 to 100 carbon atoms; and Rrepresents a divalent group expressed by -CH=CH-.