APPARATUS AND METHOD FOR CLEANING OF SUBSTRATE

PROBLEM TO BE SOLVED: To provide an apparatus and method for cleaning of a substrate, capable of ensuring the effect of cleaning that is uniform and good in both sides, concerning the cleaning of edges of the substrate targeted.SOLUTION: The method includes: controlling first and second on-off valve...

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Bibliographische Detailangaben
Hauptverfasser: NAKATSUJI HACHIRO, MIMURA YOSHIHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an apparatus and method for cleaning of a substrate, capable of ensuring the effect of cleaning that is uniform and good in both sides, concerning the cleaning of edges of the substrate targeted.SOLUTION: The method includes: controlling first and second on-off valves 29, 30 of first and second cleaner supply mechanisms for supplying a cleaning liquid on respective pressing surfaces of two pressing members sandwiching the edges of the substrate; and performing individual applying operation for supplying the cleaner by using two nozzles to respective pressing surfaces of both sides at a different timing that is temporally separated by a predetermined time lag specified by a predetermined interval time T3. By this arrangement, the effect of cleaning the substrate that is uniform and good in both sides can be ensured, even if using different piping from a supply tank to both sides of edges targeted for supplying the cleaner.