SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To prevent degradation of yield as well as degradation of reliability of a semiconductor device which are caused by burrs generated in cutting out semiconductor chips, and to increase the number of semiconductor chips that are available.SOLUTION: On the upper surface of a semic...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To prevent degradation of yield as well as degradation of reliability of a semiconductor device which are caused by burrs generated in cutting out semiconductor chips, and to increase the number of semiconductor chips that are available.SOLUTION: On the upper surface of a semiconductor chip having a planar square shape, a plurality of bonding pads 14 and a plurality of pad fragments 19 of inspection pads are formed. Here, the plurality of pad fragments 19 are formed along two sides facing each other, among four sides of the semiconductor chip. The plurality of bonding pads 14 are formed along two different sides. |
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