METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To improve luminous efficiency and prevent a crack and a chip from occurring in a light-emitting element, such as a light-emitting diode (LED) element, without providing the LED element with a light reflective layer, which causes an increase in manufacturing cost, when the ligh...

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Bibliographische Detailangaben
Hauptverfasser:	KANIZAWA MORIYUKI, UMAGOE HIDEAKI, NAMIKI HIDEJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve luminous efficiency and prevent a crack and a chip from occurring in a light-emitting element, such as a light-emitting diode (LED) element, without providing the LED element with a light reflective layer, which causes an increase in manufacturing cost, when the light-emitting element is mounted on a wiring board using an anisotropic conductive adhesive in a flip-chip-mount manner to manufacture a light-emitting device.SOLUTION: A light-reflective anisotropic conductive adhesive which contains a thermoset resin composition, conductive particles, and light-reflective isolation particles is disposed between a light-emitting element and a wiring board to be connected with the light-emitting element; and subsequently, the light-emitting element is connected on a wiring board in an anisotropic conductive manner by heating and pressurizing through use of an elastomer head whose pressing surface has a Shore A rubber hardness (JIS K6253) at least 40 and less than 90, thereby manufacturing the light-emitting device.