METHOD FOR MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT, AND RESIN MOLDED ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To achieve stable continuous production of a resin molded electronic component by preventing nozzle clogging during resin molding.SOLUTION: The method for manufacturing a resin molded electronic component includes: arranging an element in a cavity 15 of a first mold that includ...

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Hauptverfasser:	SHIMAZAKI YUKIHIRO, TAIHEI MASAHIKO, KURITA JUNICHI, TASEI MASATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INDUCTANCES MAGNETS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSFORMERS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Zusammenfassung:	PROBLEM TO BE SOLVED: To achieve stable continuous production of a resin molded electronic component by preventing nozzle clogging during resin molding.SOLUTION: The method for manufacturing a resin molded electronic component includes: arranging an element in a cavity 15 of a first mold that includes the cavity with its top face opened;injecting a main agent 17 containing a norbornene resin and a catalyst-containing curing agent 19 into the cavity 15 from separate nozzles; and arranging a second mold on the first mold so as to cover the cavity 15 to cure the norbornene resin. The norbornene resin is not cured in the nozzle, thereby preventing nozzle clogging to enable stable continuous production of the resin molded electronic component.