RESIN SEALING APPARATUS AND RESIN SEALING METHOD

PROBLEM TO BE SOLVED: To stably supply a sealed article of high quality by improving detection accuracy of a contact position between a first metallic die and a second metallic die in a resin sealing apparatus.SOLUTION: The resin sealing apparatus 100 is provided with: a metallic mold position index...

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1. Verfasser: KONO RYUTA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To stably supply a sealed article of high quality by improving detection accuracy of a contact position between a first metallic die and a second metallic die in a resin sealing apparatus.SOLUTION: The resin sealing apparatus 100 is provided with: a metallic mold position index value-measuring unit 122 for measuring a metallic mold position index value X which changes in relation to a relative position between a first metallic mold 114 and a second metallic mold 115; a closing pressure-measuring unit 124 for measuring closing pressure P actually applied to the first metallic mold 114 and the second metallic mold 115; a calculation unit 126 for estimating and calculating the corresponding metallic mold position index value XO when the closing pressure P is zero from a relation between two or more closing pressure PA, PB obtained after the closing pressure P reaches a predetermined value PA and metallic mold position index values XA, XB; and further, a detecting mechanism 121 of the contact position between the first metallic die 114 and the second metallic die 115, with the corresponding metallic mold position index value XO when the closing pressure P is zero as a contact position between the first metallic die 114 and the second metallic die 115.