POWER CONVERSION APPARATUS

PROBLEM TO BE SOLVED: To reduce the inductance of DC terminal connections between a capacitor module 500 and power semiconductor modules 300 of a power conversion apparatus.SOLUTION: A capacitor module 500 is fixed to a channel forming element 12, and a plurality of power semiconductor modules 300 o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAJIMA KENICHIRO, MAEDA KEN, KASE MASAMICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To reduce the inductance of DC terminal connections between a capacitor module 500 and power semiconductor modules 300 of a power conversion apparatus.SOLUTION: A capacitor module 500 is fixed to a channel forming element 12, and a plurality of power semiconductor modules 300 of double-face cooling structure are inserted and fixed in a cooling medium channel formed along the outer periphery of the capacitor module 500. DC terminals in a laminated state of the capacitor module 500 are raised in a direction opposite to the channel. Subsequently, connections located on the front ends of the DC terminals of the capacitor module 500 are connected by welding in a structure in which DC terminals in a laminated state of the power semiconductor modules 300 are held between the connections at both sides in the direction along the cooling medium channel.