HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a heat dissipating substrate in which heat dissipation is improved by containing an oxide insulating layer of porous structure and a fine pattern can be formed by containing a circuit layer embedded in an oxide insulating layer, and to provide a method of manufacturing the same.SOLUTION: A heat dissipating substrate 100 includes a metal core layer 10, a first insulating layer 20 which is formed on one surface or both surfaces of the metal core layer 10 and composed of a barrier layer making contact with the metal core layer 10 and a porous layer having first pores and second pores different in diameter and coupled to the barrier layer, a first circuit layer 30 which is embedded in the first insulating layer 20, filled in the second pore in the porous layer, and coupled to the side of the second pore, and a second insulating layer 40 formed on the porous layer of the first insulating layer 20. In the heat dissipating substrate 100, a part of the second pore is filled by the first circuit 30, and the second insulation layer 40 is filled in the second pore so as to form a flat surface together with the first insulation layer 20.