SUBSTRATE HOLDING ROTATING DEVICE AND SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate holding rotating device, along with a substrate processing apparatus, capable of processing a substrate, while protecting the center of one surface of the substrate, and also satisfactorily performs a prescribed rotation processing in the substrate at a plurality of positions different in a rotary axial direction.SOLUTION: A spin chuck 3 includes: a center chuck 7 for supporting the lower surface center of a wafer W; an outer circumferential ring member 8 for supporting the lower surface peripheral edge of the wafer W; and a first seal member 9 for performing sealing between the lower surface peripheral edge of the wafer W and the outer circumferential ring member 8. A suction base 10 is elevated and lowered by an elevation motor among a processing position, a lower surface rinse position, and a taking position. A suction port 26 and suction grooves 27 are formed in the upper surface 10a of the suction base 10. Orifices 30 opened in the sides of the suction base 10 are connected to the suction grooves 27.