RADIATION-CURABLE SEMICONDUCTOR WAFER SURFACE-PROTECTING ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide a semiconductor wafer surface-protecting adhesive tape which can reduce melting and heat shrinkage of the semiconductor wafer surface-protecting adhesive tape even if used in a heating process, rarely causes breakage of a semiconductor wafer, poor peeling of the adhe...

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Bibliographische Detailangaben
1. Verfasser:	OKURA MASATO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor wafer surface-protecting adhesive tape which can reduce melting and heat shrinkage of the semiconductor wafer surface-protecting adhesive tape even if used in a heating process, rarely causes breakage of a semiconductor wafer, poor peeling of the adhesive tape or the like, and can reduce adhesive power by irradiating radioactive rays.SOLUTION: The semiconductor wafer surface-protecting adhesive tape includes; a resin base film; and an adhesive layer formed on the resin base film. In a radiation-curable semiconductor wafer surface-protecting adhesive tape, the resin base film comprises a resin composition including polyethylene naphthalate as a principal component; and the adhesive layer comprises an adhesive composition including a compound having a radiation-curable carbon-carbon double bond (A), and two or more kinds of photopolymerization initiators containing an acylphosphine oxide photopolymerization initiator (C-1) and a photopolymerization initiator (C-2) other than the acylphosphine oxide photopolymerization initiator.