WAFER PROCESSING TAPE
PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing tape for suppressing the occurrence of cut waste in dicing and sticking between adjacent semiconductor chips, and for suppressing a pickup mistake.SOLUTION: In a pressure-sensitive adhesive tape 10 for wafer processing, a bonding agen...
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| creator | MORISHIMA YASUMASA INOMAE CHIKAKO ISHIWATARI SHINICHI |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing tape for suppressing the occurrence of cut waste in dicing and sticking between adjacent semiconductor chips, and for suppressing a pickup mistake.SOLUTION: In a pressure-sensitive adhesive tape 10 for wafer processing, a bonding agent layer 12b is stacked onto a base film 12a. In this case, a thickness of the bonding agent layer 12b is ≥1 um and less than 10 um, tanδ(A) of the bonding agent layer 12b at 80°C is ≥0.05 and ≤0.20, tanδ(B) of the bonding agent layer 12b at 25°C is ≥0.15 and ≤0.25 while being provided to a pickup process, and further tanδ(A)/tanδ(B), namely a ratio of tanδ(A) to tanδ(B), is ≥0.30 and ≤0.77. |
| format | Patent |
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In this case, a thickness of the bonding agent layer 12b is ≥1 um and less than 10 um, tanδ(A) of the bonding agent layer 12b at 80°C is ≥0.05 and ≤0.20, tanδ(B) of the bonding agent layer 12b at 25°C is ≥0.15 and ≤0.25 while being provided to a pickup process, and further tanδ(A)/tanδ(B), namely a ratio of tanδ(A) to tanδ(B), is ≥0.30 and ≤0.77.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111020&DB=EPODOC&CC=JP&NR=2011211129A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111020&DB=EPODOC&CC=JP&NR=2011211129A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORISHIMA YASUMASA</creatorcontrib><creatorcontrib>INOMAE CHIKAKO</creatorcontrib><creatorcontrib>ISHIWATARI SHINICHI</creatorcontrib><title>WAFER PROCESSING TAPE</title><description>PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing tape for suppressing the occurrence of cut waste in dicing and sticking between adjacent semiconductor chips, and for suppressing a pickup mistake.SOLUTION: In a pressure-sensitive adhesive tape 10 for wafer processing, a bonding agent layer 12b is stacked onto a base film 12a. 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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | WAFER PROCESSING TAPE |
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