WAFER PROCESSING TAPE

PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing tape for suppressing the occurrence of cut waste in dicing and sticking between adjacent semiconductor chips, and for suppressing a pickup mistake.SOLUTION: In a pressure-sensitive adhesive tape 10 for wafer processing, a bonding agent layer 12b is stacked onto a base film 12a. In this case, a thickness of the bonding agent layer 12b is ≥1 um and less than 10 um, tanδ(A) of the bonding agent layer 12b at 80°C is ≥0.05 and ≤0.20, tanδ(B) of the bonding agent layer 12b at 25°C is ≥0.15 and ≤0.25 while being provided to a pickup process, and further tanδ(A)/tanδ(B), namely a ratio of tanδ(A) to tanδ(B), is ≥0.30 and ≤0.77.