METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method capable of reducing the weight of a semiconductor device.SOLUTION: In a method of manufacturing a semiconductor device, in a state that a laser-transparent back surface protective tape 67 is pasted to the back surface of a semiconductor wafer o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	EDASAWA KENJI, NAYA KINICHI, FUJII NOBUMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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