METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method capable of reducing the weight of a semiconductor device.SOLUTION: In a method of manufacturing a semiconductor device, in a state that a laser-transparent back surface protective tape 67 is pasted to the back surface of a semiconductor wafer o...

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Bibliographische Detailangaben
Hauptverfasser:	EDASAWA KENJI, NAYA KINICHI, FUJII NOBUMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method capable of reducing the weight of a semiconductor device.SOLUTION: In a method of manufacturing a semiconductor device, in a state that a laser-transparent back surface protective tape 67 is pasted to the back surface of a semiconductor wafer on the main surface side on which a circuit is formed, the back surface of the semiconductor wafer is irradiated with a laser 69 over the back surface protective tape 67, marking is applied on the back surface of the semiconductor wafer, and the semiconductor wafer is divided into a plurality of individual semiconductor chips 11 before or after the marking, and after marking and dicing, the plurality of semiconductor chips 11 are peeled off from the back surface protective tape 67.