PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a fabricating method sufficiently reinforcing junction to a printed circuit board in mounting an electronic component onto the printed circuit board while ensuring a repairing property.SOLUTION: A printed circuit board unit includes the printed circuit board, and the...

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Hauptverfasser: IRIGUCHI SHIGEO, NAKAMURA NAOKI, HATANAKA KIYOYUKI, TAKETOMI NOBUO
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creator IRIGUCHI SHIGEO
NAKAMURA NAOKI
HATANAKA KIYOYUKI
TAKETOMI NOBUO
description PROBLEM TO BE SOLVED: To provide a fabricating method sufficiently reinforcing junction to a printed circuit board in mounting an electronic component onto the printed circuit board while ensuring a repairing property.SOLUTION: A printed circuit board unit includes the printed circuit board, and the electronic component electrically connected to a predetermined position on the printed circuit board by solder bonding and bonded to the printed circuit board with an adhesive layer. A partial region of the adhesive layer between the printed circuit board and the electronic component is a multi-layer laminated region 34 having a first reinforcing resin layer 30 on the printed circuit board side and a second reinforcing resin layer 32 higher in bond strength than the first reinforcing resin layer 30 on the electronic component side.
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recordid cdi_epo_espacenet_JP2011211002A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
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