PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a fabricating method sufficiently reinforcing junction to a printed circuit board in mounting an electronic component onto the printed circuit board while ensuring a repairing property.SOLUTION: A printed circuit board unit includes the printed circuit board, and the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IRIGUCHI SHIGEO, NAKAMURA NAOKI, HATANAKA KIYOYUKI, TAKETOMI NOBUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a fabricating method sufficiently reinforcing junction to a printed circuit board in mounting an electronic component onto the printed circuit board while ensuring a repairing property.SOLUTION: A printed circuit board unit includes the printed circuit board, and the electronic component electrically connected to a predetermined position on the printed circuit board by solder bonding and bonded to the printed circuit board with an adhesive layer. A partial region of the adhesive layer between the printed circuit board and the electronic component is a multi-layer laminated region 34 having a first reinforcing resin layer 30 on the printed circuit board side and a second reinforcing resin layer 32 higher in bond strength than the first reinforcing resin layer 30 on the electronic component side.