HEAT PUMP DEVICE

PROBLEM TO BE SOLVED: To prevent deterioration in performance by resolving the deviation of a flow of heat-receiving target gas even when the flow of the heat-receiving target gas is uneven between a first divided part and a second divided part.SOLUTION: A refrigerant circuit 5 is divided into a fir...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI HIDEKI, HISAKADO YOSHINORI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent deterioration in performance by resolving the deviation of a flow of heat-receiving target gas even when the flow of the heat-receiving target gas is uneven between a first divided part and a second divided part.SOLUTION: A refrigerant circuit 5 is divided into a first flow passage 8 and a second flow passage 9 by a distribution part 7 short of an evaporator 4. and is configured to freely join the first flow passage 8 and the second flow passage 9 that passed through the evaporator 4. The evaporator 4 is divided into the first divided part 10 in which the first flow passage 8 is arranged and the refrigerant R of the first flow passage 8 receives heat from the heat-receiving target gas P, and the second divided part 11 in which the second flow passage 9 is arranged and the refrigerant R of the second flow passage 9 receives heat from the heat-receiving target gas P. A heat pump device includes a ventilation means 12 for passing the heat-receiving target gas P through the first divided part 10 and the second divided part 11, and ventilation state adjusting means 17, 18 capable of freely adjusting a ventilation state of the heat-receiving target gas P to the first divided part 10 and a ventilation state of the heat-receiving target gas P to the second divided part 11.