ELECTROMAGNETIC WAVE SHIELDING MATERIAL

PROBLEM TO BE SOLVED: To prevent a hit mark occurring when an opening of a conductor pattern layer is electrolytically plated from affecting display quality of a display picture since a conductive metal layer formed by electrolytic plating on a surface on a conductive projected pattern layer as a co...

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Bibliographische Detailangaben
Hauptverfasser: IMAIZUMI TAKEAKI, KYODA YUKIHIRO, KANBARA KUMIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a hit mark occurring when an opening of a conductor pattern layer is electrolytically plated from affecting display quality of a display picture since a conductive metal layer formed by electrolytic plating on a surface on a conductive projected pattern layer as a conductor pattern layer with the conductive projected pattern layer for highly achieving both of electromagnetic wave shielding performance and optical transparency in an electromagnetic wave shielding material typically used for a display front surface.SOLUTION: In the electromagnetic shielding material 10, the conductive projected pattern layer 3 including conductive particles and binder resin and the conductive metal layer 4 formed by electroplating on the surface of the layer 3 are formed on a transparent substrate 1 as the conductor pattern layer 2. The number of the hit marks 6 which exist in the opening 5 of the conductor pattern layer 2 and whose diameter is 0.5 mm or more is zero/cmand that of the hit marks whose diameter is