CONDUCTIVE PARTICLE, MANUFACTURING METHOD OF CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

PROBLEM TO BE SOLVED: To provide conductive particles of which the connection resistance between electrodes hardly becomes high even if a connection structure is exposed in a high temperature and high moisture environment when the connection structure is obtained by connecting between the electrodes, and a connection structure using the conductive particles.SOLUTION: The conductive particles 1 are provided with base material particles 2, a copper layer 3 arranged on a surface 2a of the base material particles 2, and a palladium layer 4 arranged on a surface 3a of the copper layer 3. An average thickness of the palladium layer 4 is 5 nm or more. The palladium layer 4 is formed by using a plating liquid containing a hydrazine compound as a reducing agent. The connection structure has a first connecting object member, a second connecting object member, and a connection part for connecting the first and the second connecting object members. The connection part is formed of the conductive particles 1 or an anisotropic conductive material containing the conductive particles 1.