COOLING PANEL

PROBLEM TO BE SOLVED: To provide a substantially uniform temperature throughout the whole panel area by suppressing uneven temperature throughout the whole area of a cooling panel.SOLUTION: In the cooling panel 1, a lot of heat absorbing plates 2 having a pipe 9 vertically arranged for passing a hea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATSUDA KATSUMI, HOSOKI FUMIO, YOKOMOTO YOSHINAGA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substantially uniform temperature throughout the whole panel area by suppressing uneven temperature throughout the whole area of a cooling panel.SOLUTION: In the cooling panel 1, a lot of heat absorbing plates 2 having a pipe 9 vertically arranged for passing a heating medium are arranged. Inside the heat absorbing plates 2, the pipe 9 extended to the vertical direction and bent in a U-shape in a lower part of the absorbing plate 2 is provided, and the pipe 9 is mutually connected on an upper part side of the heat absorbing plate 2, and thereby, flow paths 7 and 8 for supplying the heat medium to the heat absorbing plates 2 are formed.