RESIN PASTE FOR DIE BONDING, AND ITS USE

PROBLEM TO BE SOLVED: To provide a resin paste for die bonding that is easily supplied and applied by a printing method to even a substrate which needs to be stuck at relatively low temperature, and to provide a use of a semiconductor device etc., using the same. SOLUTION: The resin paste for die bo...

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Bibliographische Detailangaben
Hauptverfasser:	EHANA SATORU, KAWASUMI MASAO, KIKUCHI NOBURU, YAMAZAKI MITSUO, HASEGAWA YUJI, ODAKAWA YASUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin paste for die bonding that is easily supplied and applied by a printing method to even a substrate which needs to be stuck at relatively low temperature, and to provide a use of a semiconductor device etc., using the same. SOLUTION: The resin paste for die bonding includes a carboxylic acid-terminated butadiene homopolymer or copolymer (A), a thermosetting resin (B), a filler (C), and a printing solvent (D), wherein the elastic modulus of the resin paste after dry curing is in a range of 1 to 100 MPa (25°C). The solid content is preferably from 40 to 90 wt.%, the thixotropy index is preferably from 1.5 to 8.0, and the viscosity (25°C) is preferably from 5 to 1,000 Pa s. Using this resin paste, a semiconductor device is produced by a method including (1) applying a predetermined quantity of the resin paste to a substrate, (2) drying the resin paste to bring the resin to B-stage, (3) mounting a semiconductor chip on the B-stage resin, and (4) post-curing of the resin. COPYRIGHT: (C)2011,JPO&INPIT