SURFACE-MOUNTED ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a surface-mounted electronic component that secures sufficient connection strength for a wiring board, and suppresses inclination in width direction of a body and remaining of a void in solder during mounting. SOLUTION: On the surface-mounted electronic component 1A, wet spreading of molten solder P is induced along a width direction of the body 2. Consequently, surface tension of the molten solder P is dispersed along the width direction of the body 2, which is thereby easy to balance, so inclination of the body 2 along the width direction during the mounting is suppressed. Further, the molten solder P is dispersed to a first electrode portion 31, a second electrode portion 32, and a connecting electrode portion 33 respectively to secure sufficient connection strength for the wiring board 5. Further, a void in the molten solder P is easy to move away from an outer recess 35 and an inner recess 34 of a terminal electrode 3A, thereby preventing the void from remaining in the solder. COPYRIGHT: (C)2011,JPO&INPIT