PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a plasma processing device capable of safely and properly arranging matching boxes. SOLUTION: The plasma processing device includes: a chamber 1 which can be sealed up and into which a reactive source gas is introduced; a plurality of discharge sections 13 disposed opposite to one another in the chamber 1 to generate plasma discharge, each of the discharge sections 13 being composed of a pair of a cathode electrode 11 and an anode electrode 12; power supply sections E1, E2 disposed outside the chamber 1 to supply power to all of the discharge sections 13; a plurality of matching boxes M1, M2 electrically connected to the power supply sections E1, E2 outside the chamber 1; at least one support section A11, A12 disposed outside the chamber 1 to support the plurality of matching boxes M1, M2; and a plurality of conductors C11, C12 electrically connecting the plurality of matching boxes M1, M2 to the cathode electrodes 11 of all of the discharge sections 13. The support portion A11, A12 is designed to support at least one matching box M1, M2 at a position where the plurality of conductors C11, C12 can be of the same length. COPYRIGHT: (C)2011,JPO&INPIT