PHOTOSENSITIVE ADHESIVE RESIN COMPOSITION, ADHESIVE FILM, AND LIGHT-RECEIVING DEVICE

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive resin composition having good developability to be used as a spacer for a substrate on which a transparent substrate and a semiconductor element are mounted, an adhesive film using the same, and a light-receiving device. SOLUTION: A photosen...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI TOYOSEI, TAKAYAMA RIE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive adhesive resin composition having good developability to be used as a spacer for a substrate on which a transparent substrate and a semiconductor element are mounted, an adhesive film using the same, and a light-receiving device. SOLUTION: A photosensitive adhesive resin composition characterized by containing a compound (A) having a hydroxy group or a carboxy group and a (meth)acryloyl group, a compound (B) thermosettingly reactive with the compound (A) having a hydroxy group or a carboxy group and the (meth)acryloyl group, a compound (C) having a (meth)acryloyl group but not having a hydroxy group and a carboxy group, a phenol resin or phenol (D), and a sensitizer (E). The photosensitive adhesive resin composition is provided to achieve the objects described above. COPYRIGHT: (C)2011,JPO&INPIT