APPARATUS FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a treating apparatus which permits reducing the foot-print with neither lowering throughput nor accompanied problem in constructing the apparatus, while having a plurality of high flexibility in the treatment of treating units. SOLUTION: The treating apparatus includes: an application treatment unit 23 provided with a plurality of treatment units including a resist application treatment unit each built in and a transferring mechanism; a development treatment unit 24 arranged in parallel with the application treatment unit 23 and provided with a plurality of treatment units including a transferring mechanism and a resist development treatment unit each built in; a heat treatment unit 27 for heat-treating a treatment substrate including a first pass unit for receiving the treatment substrate from the application treatment unit 23 and a second pass unit for transferring the treatment substrate to the development treatment unit 24; another transferring mechanism 36 for transferring the treatment substrate arranged on the heat treatment unit 27; a linear space 40 provided between the development treatment unit 24 and the application treatment unit 23; and a transferring mechanism 41 outside the treatment units arranged in the space 40 for transferring the treatment substrate. COPYRIGHT: (C)2011,JPO&INPIT