MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a low resistance and a high connection reliability, which eliminates the failure to bond an inner layer core substrate and a prepreg sheet, and the whitening inside the multilayer printed wiring board in appearance. SOLUTION:...

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Bibliographische Detailangaben
1. Verfasser:	FUKAZAWA HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a low resistance and a high connection reliability, which eliminates the failure to bond an inner layer core substrate and a prepreg sheet, and the whitening inside the multilayer printed wiring board in appearance. SOLUTION: The multilayer printed wiring board includes: an inner layer core substrate in which a pattern for preventing resin streak is formed in the vicinity of a power source, the ground or an antenna circuit; and the prepreg sheet having an interlayer conduct hole formed by filling a through-hole with a conductive paste. The inner layer core substrate and the prepreg sheet are laminated and thermally pressed to manufacture the multilayer printed wiring board. COPYRIGHT: (C)2011,JPO&INPIT