RESIN SEALED POWER MODULE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a resin sealed power module easily improved in insulation characteristic without a harmful effect, and to provide a method of manufacturing the same. SOLUTION: The resin sealed power module includes an insulating board, a power semiconductor element arranged on the i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TADAKUMA TOSHIYA, KANO TAKETOSHI, SUDO SHINGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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