RESIN SEALED POWER MODULE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a resin sealed power module easily improved in insulation characteristic without a harmful effect, and to provide a method of manufacturing the same. SOLUTION: The resin sealed power module includes an insulating board, a power semiconductor element arranged on the i...

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Bibliographische Detailangaben
Hauptverfasser:	TADAKUMA TOSHIYA, KANO TAKETOSHI, SUDO SHINGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin sealed power module easily improved in insulation characteristic without a harmful effect, and to provide a method of manufacturing the same. SOLUTION: The resin sealed power module includes an insulating board, a power semiconductor element arranged on the insulating board, a plurality of hollow cylindrical sockets arranged on the insulating board, and a resin case in which a plurality of recesses are formed on its upper surface, and is so formed as to cover the power semiconductor element and the plurality of hollow cylindrical sockets. The plurality of hollow cylindrical sockets are exposed from the plurality of recesses in such manner as a single hollow cylindrical socket among the plurality of hollow cylindrical sockets is exposed from a single recess among the plurality of recesses. COPYRIGHT: (C)2011,JPO&INPIT