OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an optical semiconductor device having good luminous characteristics by suppressing deterioration and discoloration in a reflection part and improving adhesion between a translucent sealing resin and a sub-mount. SOLUTION: An LED device 101 is configured such that el...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KISHIMOTO YUKIO, FUTAGAWA TOMOYUKI, FUKUNAGA TAKAHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an optical semiconductor device having good luminous characteristics by suppressing deterioration and discoloration in a reflection part and improving adhesion between a translucent sealing resin and a sub-mount. SOLUTION: An LED device 101 is configured such that electrodes 103a and 103b and wiring layers 103c and 103d separated from the electrodes and serving as reflection parts are provided on an upper surface of a sub-mount element 103, and an LED element 102 is flip-chip bonded on the electrodes 103a and 103b. A functional organic molecule 111 is self-organized to form an organic coating 110 on the surfaces of the wiring layers 103c and 103d. A sealing resin part 108 seals the sub-mount element and the LED element. COPYRIGHT: (C)2011,JPO&INPIT