STRUCTURE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To downsize a mounting structure of a semiconductor device called an SOI. SOLUTION: A rear face of a silicon substrate 23 of a semiconductor device 21 mounted to a printed wiring board 1 is connected to an upper layer ground line 4 of the printed wiring board 1 via a conductive...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAWAMURA MASAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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