STRUCTURE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To downsize a mounting structure of a semiconductor device called an SOI. SOLUTION: A rear face of a silicon substrate 23 of a semiconductor device 21 mounted to a printed wiring board 1 is connected to an upper layer ground line 4 of the printed wiring board 1 via a conductive adhesive layer 55, a shield cover 51, and a solder layer 11. By this, the rear face of the silicon substrate 23 of the semiconductor device 21 has ground potential. Since connection is established with the ground line 4 via the shield cover 51 in this case, a ground connection terminal connected to the rear face of the silicon substrate 23 of the semiconductor device 21 is not necessary to be arranged on the printed wiring board 1 around a mounting region of the semiconductor device 21. Since the shield cover 51 also serves as an anti-noise measure, the shield cover 51 is not necessary to be arranged outside the semiconductor device 21 and the ground connection terminal, and the structure can be downsized. COPYRIGHT: (C)2011,JPO&INPIT