CONDUCTIVE FIBER AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a conductive fiber with superior conductivity by using a metal plating method of fiber capable of simplifying treating processes and facilitating supplementary treatment such as waste liquid treatment. SOLUTION: The conductive fiber is provided by: a solution includi...

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Bibliographische Detailangaben
Hauptverfasser: SENDA MIYUKI, SHIIKI HIROSHI, NAGAOKA TSUTOMU, MAYAMA TAKATOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a conductive fiber with superior conductivity by using a metal plating method of fiber capable of simplifying treating processes and facilitating supplementary treatment such as waste liquid treatment. SOLUTION: The conductive fiber is provided by: a solution including an organic binder which has a part capable of combining with an organic fiber according to chemical bonding and a part capable of combining with metal fine particle according to adsorption, and a metal colloid is prepared as a plating bath; a precursor conductive fiber obtained by metal-plating the organic fiber according to nonelectrolytic plating method using the plating bath is subjected to thermal treatment at a temperature less than the melting point of a fiber body constituting the precursor conductive fiber; and, thereafter, the precursor conductive fiber is replated according to nonelectrolytic plating method using a liquid including the metal colloid to provide the conductive fiber. COPYRIGHT: (C)2011,JPO&INPIT