GLASS FOR SEALING SEMICONDUCTOR, MANTLE TUBE FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide glass for sealing a semiconductor, the glass having high heat resistance and low temperature sealing property even when the glass does not contain a harmful component such as PbO. SOLUTION: The sealing glass has a strain point of 650°C or higher and shows a temperatu...

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Bibliographische Detailangaben
1. Verfasser:	YANASE TOMOMOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide glass for sealing a semiconductor, the glass having high heat resistance and low temperature sealing property even when the glass does not contain a harmful component such as PbO. SOLUTION: The sealing glass has a strain point of 650°C or higher and shows a temperature of lower than 1,200°C at a viscosity of 104dPa s. Specifically, the glass has a glass composition of, by mass%, 30 to 50% of SiO2, 0 to 10% of Al2O3, 0 to 20% of CaO+SO (sum amount of CaO and SrO), 15 to 35% of BaO, 0 to 25% of ZrO2+TiO2(sum amount of ZrO2and TiO2), and 0 to 20% of La2O3+Nb2O5(sum amount of La2O3and Nb2O5). COPYRIGHT: (C)2011,JPO&INPIT