METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To divide a wiring board which has been collectively sealed, without applying stress to an external terminal mounting surface of the wiring board. SOLUTION: A multi-piece board 7 having a plurality of device regions formed on a main surface thereof is prepared. Semiconductor chips are fixed in the plurality of device regions respectively. After the semiconductor chips are fixed, the plurality of semiconductor chips are collectively sealed with a resin to form a collectively sealing portion 8. The collectively sealing portion 8 and the multi-piece board 7 are divided into the device regions by dicing. After the division, surfaces of respective sealing portions are brushed, and then respective semiconductor devices are temporarily stored in pockets of a tray and are individually conveyed from the tray. Since a surface of the correctively sealing portion 8 is sucked by vacuum to perform dicing when the multi-piece board 7 is divided after collective sealing, the multi-piece board 7 can be divided without applying stress to the external terminal-mounting surface of the multi-piece board 7. COPYRIGHT: (C)2011,JPO&INPIT