SILVER TREATMENT AGENT, TREATMENT METHOD OF SILVER, AND METHOD OF FORMING CONDUCTOR PATTERN

PROBLEM TO BE SOLVED: To provide a silver treatment agent which is capable of safely treating silver and is capable of shaping silver into a desired pattern and of improving a shape of a pattern side when forming a silver conductor pattern, and to provide a treatment method of silver, and a method of forming a conductor pattern. SOLUTION: The silver treatment agent contains: halogen ions; copper and/or iron ions; and at least one kind selected from a group consisting of imidazole, an imidazole compound having a C1-4 alkyl substituent at a carbon atom or a nitrogen atom at position 1, 2 or 4, and 1,2-dialkylimidazole. The silver treatment method uses this silver treatment agent. The method of forming a conductor pattern uses the silver treatment agent and the silver treatment method. COPYRIGHT: (C)2011,JPO&INPIT