APPARATUS AND METHOD OF PHYSICAL VAPOR DEPOSITION WITH MULTI-POINT CLAMP

PROBLEM TO BE SOLVED: To provide an apparatus and method of physical vapor deposition with a multi-point clamp. SOLUTION: The physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate. COPYRIGHT: (C)2011,JPO&INPIT