PRETREATMENT AGENT AND PRETREATMENT METHOD FOR ELECTROPLATING AND ELECTROPLATING METHOD

PROBLEM TO BE SOLVED: To provide a pretreatment agent for electroplating, which does not inhibit adhesion between copper undercoat and a resist and does not inhibit adhesion between the copper undercoat and a copper electroplating film. SOLUTION: The pretreatment agent for electroplating is an aqueo...

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Hauptverfasser:	UCHIUMI MASAYUKI, OMURA NAOYUKI, OKAMACHI TAKUYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pretreatment agent for electroplating, which does not inhibit adhesion between copper undercoat and a resist and does not inhibit adhesion between the copper undercoat and a copper electroplating film. SOLUTION: The pretreatment agent for electroplating is an aqueous solution essentially comprising (A) at least one adsorption inhibitor chosen from the group consisting of a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant and an amphoteric surfactant and (B) chloride ion. COPYRIGHT: (C)2011,JPO&INPIT