SURFACE ADHESION JOINING METHOD USING PLATE SOLDER

PROBLEM TO BE SOLVED: To solve a problem that there is a scrubbing method as a solder joining method capable of reducing occurrence of voids, but the scrubbing method is not simply used depending on a shape or the like of a part to be joined. SOLUTION: A surface adhesion joining method using a plate...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE TOMOKAZU, NOZOE GIICHI, KANAYAMA TAKASHI, SAMEJIMA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve a problem that there is a scrubbing method as a solder joining method capable of reducing occurrence of voids, but the scrubbing method is not simply used depending on a shape or the like of a part to be joined. SOLUTION: A surface adhesion joining method using a plate solder includes: a screw fixing step for fixing a metal plate with a screw while urging the metal plate toward a base in a state that the plate solder is sandwiched by the metal plate and a metal surface to be a base; a temperature increasing step for increasing the temperature of the metal plate to a solder melting temperature in a state that the metal plate is fixed while urging it toward the base in the fixing step; and a temperature decreasing step for decreasing the temperature of the metal plate to a normal temperature for solidifying the solder in a molten state in the temperature increasing step while similarly urging the metal plate. COPYRIGHT: (C)2011,JPO&INPIT