SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device having a package structure of high connection reliability with respect to a wiring board. SOLUTION: In a compact surface mounting package, one end of a source frame 5 (third part 5c) and one end of a gate frame 6 (third part 6c) are exposed, re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASHIDA YOSHIAKI, KONO KENYA, KOIKE SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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