SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device having a package structure of high connection reliability with respect to a wiring board. SOLUTION: In a compact surface mounting package, one end of a source frame 5 (third part 5c) and one end of a gate frame 6 (third part 6c) are exposed, respectively, from one side of a mold resin 2 to the outside. Consequently, when the compact surface-mounting package is mounted on a wiring substrate 11, a connection part of the source frame 5 and a source electrode wire 13 and a connection part of the gate frame 6 and a gate electrode wire 14 can be readily recognized visually from above the wiring substrate 11. COPYRIGHT: (C)2011,JPO&INPIT