MOLD CLAMPING DEVICE

PROBLEM TO BE SOLVED: To provide a mold clamping device having a structure in which a uniform surface pressure distribution is generated on a whole mold parting surface even when the number of tie-bars is reduced to three or two, and a burr can hardly be formed. SOLUTION: The mold clamping device co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ARIMA YUICHIRO, KAMI MASAHIRO, TAKEDA TSUNEJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a mold clamping device having a structure in which a uniform surface pressure distribution is generated on a whole mold parting surface even when the number of tie-bars is reduced to three or two, and a burr can hardly be formed. SOLUTION: The mold clamping device comprises a machine base; a fixed plate which is mounted on the machine base, is fixed to the machine base, and holds a fixed mold; a fixed platen which is mounted on the anti-mold side of the fixed plate; a movable plate which is mounted slidably in the mold opening/closing direction on the machine base and holds a movable mold; a movable platen which is mounted slidably in the mold opening/closing direction on the anti-mold side of the movable plate; and two or three tie-bars which receive mold clamping force. In the mold clamping device, between the fixed plate and the fixed platen and between the movable plate and the movable platen, the mold clamping force is transmitted by a plurality of point contacts or a plurality of line contacts. COPYRIGHT: (C)2011,JPO&INPIT