SOLDERING FLUX AND SOLDER PASTE COMPOSITION

PROBLEM TO BE SOLVED: To provide a soldering flux capable of suppressing coloring of flux residues after the soldering and occurrence of any cracked state caused by a large number of cracks, and ensuring the visibility during the visual inspection even in a non-cleaned state while a rosinous resin i...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ANADA TAKAAKI, KASHIWAGI SHINICHIRO, KUMAMOTO SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a soldering flux capable of suppressing coloring of flux residues after the soldering and occurrence of any cracked state caused by a large number of cracks, and ensuring the visibility during the visual inspection even in a non-cleaned state while a rosinous resin is contained as a base resin, and a solder paste composition using the same. SOLUTION: The soldering flux is a non-cleaning flux containing rosin-based resin as the base resin, wherein the percentage content of an abietic acid type resinous acid having conjugate double bonds contained in the rosin-based resin is 2-5 wt.%. The rosin-based resin is preferably one or more kinds selected from the group composed of a hydrogenated rosin and a disproportionated rosin. The solder paste composition contains the above flux and solder alloy powder. The above flux or the soldering paste composition preferably contains an oxidation inhibitor. COPYRIGHT: (C)2011,JPO&INPIT